| | Boron Nitride, BN Material Properties Boron
nitride is a white solid material in the as produced hot pressed form.
It is a low porosity solid. It is easily machined into complex shapes
using standard carbide tooling. The material is anisotropic in its
electrical and mechanical properties due to the platy hexagonal
crystals and their orientation during the hot press consolidation. .Key Boron Nitride Properties |
 | High thermal conductivity | |
| Low thermal expansion | |
| Good thermal shock resistance | |
| High electrical resistance | |
| Low dielectric constant and loss tangent | |
| Microwave transparency | |
| Non toxic | |
| Easily machined — non abrasive and lubricious | |
| Chemically inert | |
| Not wet by most molten metals |
Typical Boron Nitride Uses | |
| Electronic parts — heat sinks, substrates, coil forms, prototypes | |
| Boron doping wafers in silicon semiconductor processing | |
| Vacuum melting crucibles | |
| CVD crucibles | |
| Microcircuit packaging | |
| Sputtering targets | |
| High precision sealing, brazing, and metallizing fixtures | |
| Microwave tubes | |
| Horizontal caster break rings | |
| Low friction seals | |
| Plasma arc insulators | |
| High temperature furnace fixtures and supports | General Boron Nitride Information
Boron nitride is often referred to as “white graphite” because it is a
lubricious material with the same platy hexagonal structure as carbon
graphite. Unlike graphite, BN is a very good electrical insulator. It
offers very high thermal conductivity and good thermal shock
resistance. BN is stable in inert and reducing atmospheres up to
2800°C, and in oxidizing atmospheres to 850°C. Three
grades are commonly used, including a boric oxide binder system, a
calcium borate binder system, and a pure diffusion bonded grade. The
boric oxide containing material (Grade BO) absorbs moisture which
causes swelling and property degradation. The calcium borate containing
material (Grade CA) is moisture resistant. The pure BN material (Grade
XP) contains no binders and is used for extremes of temperature and
where purity is important. The boric oxide material is the most
commonly used grade. Download Boron Nitride grade BO datasheet Boron Nitride Engineering Properties* | Boron Nitride, Grade BO | |
| Units of Measure | Orientation to Pressing Direction | | Mechanical | SI/Metric (Imperial) | Parallel | Perpendicular | | Density | gm/cc (lb/ft3) | 1.9 | (120) | 1.9 | (120) | | Porosity | % (%) | 2.8 | 2.8 | 2.8 | 2.8 | | Color | — | white | white | white | white | | Flexural Strength | MPa (lb/in2x103) | 75.8 | (11.0) | 113 | (16.4) | | Elastic Modulus | GPa (lb/in2x106) | 46.9 | (6.8) | 73.8 | (10.7) | | Shear Modulus | GPa (lb/in2x106) | — | — | — | — | | Bulk Modulus | GPa (lb/in2x106) | — | — | — | — | | Poisson’s Ratio | — | — | — | — | — | | Compressive Strength | MPa (lb/in2x103) | 143 | (20.8) | 186 | (27.0) | | Hardness | Kg/mm2 | 15-24 | — | 15-24 | — | | Fracture Toughness KIC | MPa•m3/2 | — | — | — | — | Maximum Use Temperature
(inert atm) | °C (°F) | 1800 | (3250) | — | — | | Thermal |
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| | Thermal Conductivity | W/m•°K (BTU•in/ft2•hr•°F) | 30 | (205) | 33 | (225) | Coefficient
of Thermal Expansion | 10–6/°C (10–6/°F) | 11.9 | (6.6) | 3.1 | (1.7) | | Specific Heat | J/Kg•°K (Btu/lb•°F) | 1610 | (.38) | — | — | | Electrical |
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| | Dielectric Strength | ac-kv/mm (volts/mil) | 95 | (2400) | 79 | (2000) | | Dielectric Constant | @ 8.8 GHz | 4.6 | — | 4.2 | — | | Dissipation Factor | @ 8.8 GHz | 0.0017 | — | 0.0005 | — | | Loss Tangent | — | — | — | — | — | | Volume Resistivity | ohm•cm | >1014 | — | >1015 | — | | Boron Nitride, Grade CA | |
| Units of Measure | Orientation to Pressing Direction | | Mechanical | SI/Metric (Imperial) | Parallel | Perpendicular | | Density | gm/cc (lb/ft3) | 1.9 | (120) | 1.9 | (120) | | Porosity | % (%) | 15 | 15 | 15 | 15 | | Color | — | white | — | white | — | | Flexural Strength | MPa (lb/in2x103) | 43.4 | (6.3) | 60 | (8.7) | | Elastic Modulus | GPa (lb/in2x106) | 33.8 | (4.9) | 75 | (10.9) | | Shear Modulus | GPa (lb/in2x106) | — | — | — | — | | Bulk Modulus | GPa (lb/in2x106) | — | — | — | — | | Poisson’s Ratio | — | — | — | — | — | | Compressive Strength | MPa (lb/in2x103) | 30 | (4.4) | 44.5 | (6.5) | | Hardness | Kg/mm2 | 14-18 | — | 14-18 | — | | Fracture Toughness KIC | MPa•m1/2 | — | — | — | — | Maximum Use Temperature
(inert atm) | °C (°F) | 1800 | (3200) | — | — | | Thermal |
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| | Thermal Conductivity | W/m°K (BTU•in/ft2•hr•°F) | 27 | (187) | 31 | (215) | Coefficient
of Thermal Expansion | 10–6/°C (10–6/°F) | 2.95 | (1.6) | .87 | (.5) | | Specific Heat | J/Kg•°K (Btu/lb•°F) | 1470 | .35 | — | — | | Electrical |
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| | Dielectric Strength | ac-kv/mm (volts/mil) | 67 | (1700) | — | — | | Dielectric Constant | @ 8.8 GHz | 4.3 | — | 4 | — | | Dissipation Factor | @ 8.8 GHz | 0.0014 | — | 0.0007 | — | | Loss Tangent | — | — | — | — | — | | Volume Resistivity | ohm•cm | >1014 | — | >1014 | — | | Boron Nitride, Grade XP |
| Units of Measure | Orientation to Pressing Direction | | Mechanical | SI/Metric (Imperial) | Parallel | Perpendicular | | Density | gm/cc (lb/ft3) | 1.9 | (120) | 1.9 | (120) | | Porosity | % (%) | 14 | 14 | 14 | 14 | | Color | — | white | white | white | white | | Flexural Strength | MPa (lb/in2x103) | 13.8 | (2) | 21.4 | (3.1) | | Elastic Modulus | GPa (lb/in2x106) | 14 | (2) | — | — | | Shear Modulus | GPa (lb/in2x106) | — | — | — | — | | Bulk Modulus | GPa (lb/in2x106) | — | — | — | — | | Poisson’s Ratio | — | — | — | — | — | | Compressive Strength | MPa (lb/in2x103) | 18 | (2.6) | 23.4 | (3.4) | | Hardness | Kg/mm2 | 3-5 | — | 3-5 | — | | Fracture Toughness KIC | MPa•m1/2 | — | — | — | — | Maximum Use Temperature
(inert atm) | °C (°F) | 3000 | (5400) | — | — | | Thermal |
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| | Thermal Conductivity | W/m•°K (BTU•in/ft2•hr•°F) | 71 | (490) | 121 | (840) | Coefficient
of Thermal Expansion | 10–6/°C (10–6/°F) | 0.6 | (.33) | –.46 | (–.25) | | Specific Heat | J/Kg•°K (Btu/lb•°F) | 1470 | (.36) | — | — | | Electrical |
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| | Dielectric Strength | ac-kv/mm (volts/mil) | 80 | (2000) | 80 | (2000) | | Dielectric Constant | @ 8.8 GHz | 4 | — | 4 | — | | Dissipation Factor | @ 8.8 GHz | 0.0012 | — | 0.0003 | — | | Loss Tangent | — | — | — | — | — | | Volume Resistivity | ohm•cm | >1014 | — | >1014 | — | *All properties are room temperature values except as noted.
The data presented is typical of commercially available material and is
offered for comparative purposes only. The information is not to be
interpreted as absolute material properties nor does it constitute a
representation or warranty for which we assume legal liability. User
shall determine suitability of the material for the intended use and
assumes all risk and liability whatsoever in connection therewith. Back to top Standard Products | Custom Products and Services | Case Studies | Materials
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